Micro Switch And Low Pressure Injection Molding Process

The low-pressure injection molding and molding process, the process is straightforward; the whole system includes a low-pressure injection molding compound, a low-pressure injection molding machine, mold three parts, after molding, effectively prevent the wire from loosening, improve the joint protection, can achieve insulation, temperature resistance, impact resistance, reduction Excellent protection against shock, moisture, water, dust, chemical corrosion. 

Low-pressure (1.5~40bar) low-temperature injection molding, the low-pressure injection molding compound, has an excellent fluidity after being heated, melted, and injected into the mold. The temperature is generally below 100 degrees when contacting the component. 

The cooling molding takes only a few seconds to several tens of seconds to release the finished product. This technology originated in Europe and the United States. It has been developing in Europe and America for more than 20 years. It has been widely used in the global automotive and electronics manufacturing fields. 

Low-pressure injection molding, widely used in the packaging of electronic components, is widely used in micro-switches and waterproof connectors and can also be used in automotive engine internal connectors, with high-temperature resistance after molding. It can withstand the high temperature inside the car and protect the components; it has good air tightness and excellent waterproof effect. 

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