How To Solder Snap Action Micro Switch Terminals

The prevalent terminal type for the snap action micro switch is the solder terminal. When soldering, the soldering iron temperature should be controlled below 380 °C. If it is used in the case of poor soldering, it may cause abnormal heat and burn. The soldering temperature and time are within 350 ° C • 5 s or within 380 ° C • 3 s.

Heating for a long time may cause the outer casing to dissolve, and the wire skin is scorched, resulting in decreased features of the snap-action microswitch.

The terminal type of the snap action micro switch can also be the molded lead wires. Please ensure the insulation distance between the switch body and the mounting plate when wiring the micro switch. 

Pay attention when installing the snap action micro switch on a metal body. Use a suitable product for the capacity of the applied voltage and current. When wiring the snap action micro switch, do not perform it while the power is on. 

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